The 21st EM Innovation Awards 207

Time: Wednesday, January 28, 2026 12:00 AM - Monday, February 2 12:00 AM
Venue: 慕尼黑上海展览馆
Organiser: 慕尼黑上海
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2024 展会回顾
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论坛介绍

The 21st EM Innovation Awards 2026, founded in 2006, is a prestigious honor in the global electronic manufacturing industry. Held concurrently with Productronica China 2026 at the Shanghai New International Expo Center on March 26, it aims to recognize suppliers that have made outstanding contributions to advancing electronic manufacturing innovation. The conference will kick off with a keynote speech delivered by industry leaders, focusing on the integration of AI, digital twin, and green manufacturing in the electronic industry, and interpreting the development trend of global electronic manufacturing innovation. Subsequently, the award ceremony will be held, with a rigorous judging system by a panel of 20+ senior experts from well-known OEM/EMS enterprises, research institutions, and industry media. Entries are evaluated based on seven core dimensions including technological innovation, cost efficiency, process advancement, environmental friendliness, reliability, scalability, and market application value. This year’s awards cover six major categories closely linked to the core sectors of electronic manufacturing: SMT & Intelligent Assembly Technology, Wire Harness Processing & Connection Solutions, Intelligent Detection & Quality Control Equipment, New Materials & Dispensing Technology, Industrial Automation & Collaborative Robots, and Green Manufacturing & Energy-Saving Solutions. Each category will select one Grand Award winner and 2-3 Excellence Award winners, with the winning technologies and solutions showcased on-site to promote industry learning and cooperation. The closing session will feature an interactive forum where award-winning enterprises, judges, and industry elites will conduct in-depth discussions on the pain points and breakthrough paths of technological innovation in electronic manufacturing, building a high-end communication platform for the industry to share experience, explore cooperation opportunities, and jointly drive the high-quality development of the global electronic manufacturing industry.

重点议题
  • 技术突破-新型互连技术,先进热管理方案,封装结构与材料创新,嵌入式腔体设计
  • 产业链协同-标准建立与测试方法,成本控制与良率提升,设备与工艺协同,设计工具与仿真
  • 新应用探索-新能源汽车电驱系统,AI算力与数据中心
  • 能源基础设施

会议日程

会议日程
为何参展
为何参展
预登记
立即购票
备用按钮
2024 展会回顾
Time Topic Guest
2026-01-28 8:00 聚焦AI、数字孪生与绿色制造在半导体领域的融合应用 陈立武(Pat Gelsinger)
2026-01-28 10:00 电子制造技术创新痛点与突破路径 单忠德
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